Optimizing Polymers and Adhesive Materials with Thermogravimetric Analysis and Differential Scanning Calorimetry

Live event scheduled for May 6th, 2021 at 11:00 AM PT

Whether you’re designing parts for Formula 1 racecars, engineering biomedical implants for hospital patients, or anything in between, robust thermal analysis empowers engineers to fine-tune the thermal properties of advanced materials. The insights gained from thermal analysis can be paramount to designing high-quality parts, products, and devices.

In this webinar event, guest speaker Dr. Parth N. Vakil of TA Instruments will lend his hot take on this topic. The webinar will highlight two thermal testing techniques: thermogravimetric analysis (TGA), which measures weight loss to probe volatilization behavior and thermal stability, and differential scanning calorimetry (DSC), which measures heat flow to analyze thermodynamic properties as well as thermal response. When combined, these two techniques provide a clear picture of both a material’s thermal stability and many exothermic and endothermic events that may affect its structure and behavior.

Join in the live event to hear about the latest TGA and DSC advancements and explore how insights from these techniques are accelerating failure analysis, development, and optimization of adhesives and polymers.

Why Does Thermal Analysis of Polymers and Adhesives Matter?

Plastics – made of polymers – are nearly ubiquitous in modern industries. They provide thermal and electrical insulation in computing chips and boards that run our TVs, smartphones, and laptops; they are light and strong enough to form the backbone of Formula 1 racecar chassis; they are cheap and durable enough to package everything from modern medical supplies to groceries.

Adhesives are equivalently prevalent; they bind innumerable material surfaces together. Advances in adhesive substances have impacted health care, construction, mechanical and electrical engineering, and more. Modern wood glues are often stronger than nailed-in joints, and specialized dental adhesives are cured to medical-grade strength and sterility in seconds under UV light.

It goes to show: these materials are everywhere, and they can be customized and fine-tuned for an ever-expanding array of purposes.

Thermal analysis is crucial to engineering and optimizing high-quality polymers and adhesive materials. Their thermal properties govern their performance and behavior, impacting their underlying structure and their overall reliability, strength, and durability.

This Webinar Will Cover:

  1. Overview of DSC and TGA techniques: what properties they assess, and how they make these measurements
  2. DSC and TGA Characterization of Adhesives and Polymers for Curing and Decomposition
  3. Selection of Advanced Methods in DSC:
    • Modulated DSC
    • Cure Monitoring with DSC
  4. Selection of Advanced Methods in TGA:
    • High-resolution TGA
    • Thermal Stability Analysis via Modulated TGA

Register for the Event

About the Speakers

Parth N. Vakil, PhD

Parth N. Vakil is an Applications Engineer / Applications Scientist with TA Instruments based out of the Illinois location near Chicago. He received his engineering bachelor’s degree from the University of Toronto (Canada) with a focus in Nano-engineering. During his undergraduate studies, Parth interned in Sanofi Pasteur’s Analytical R&D Unit and participated in summer research positions at the University of Toronto and McGill University. He then moved south to Florida State University (FL) where he completed his Materials Chemistry PhD degree in the Strouse Lab. Upon graduation, he joined TA as an Applications Engineer where he supports the sales teams and current TA customers, assisting them with multiple material analysis instrumentation/methods including DSC (differential scanning calorimetry), TGA (thermogravimetric analysis), TMA (thermo-mechanical analysis), SDT (simultaneous DSC and TGA), Sorption Analysis, DMA (dynamic mechanical analysis) and Rheology.