Application Note: Covalent Metrology X-ray Diffraction Offcut Measurement
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The wafer offcut angle (the small angular tilt between the wafer surface and its internal crystallographic planes) affects key growth properties of epitaxial thin films grown on these substrates for use in modern semiconductors and advanced electronic devices. Efficient, precise measurement of the substrate offcut angle can empower engineers to refine their processing and fabrication techniques and optimize performance in their end products.
Covalent’s Director of X-ray Analysis, Dr. Colleen Frazer, assembled this Application Note to equip you with the expertise needed to navigate offcut angle measurements like a pro.
In this application note, Dr. Frazer summarizes the impact of offcut angle on thin film growth, and goes on to detail the process by which offcut angle is analyzed using X-ray Diffraction (XRD). Each step of this industry-standard procedure is demonstrated on a NIST standard Al2O3 sample wafer, and the computation of the offcut angle is provided for ready reference.
Learn more about X-ray Diffraction (XRD)
Read the Blog: Recommended Strategies for Wafer Offcut Measurement in Thin Film Applications Using X-ray Diffraction (XRD)
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X-ray Analysis at Covalent Metrology
Covalent Metrology’s X-ray Analysis team is led by Dr. Colleen Frazer, who has worked extensively with X-ray Diffraction and X-ray Reflectometry to perform advanced analysis in applications spanning academic institutions, national labs, and numerous private companies. Dr. Frazer and her team utilize the cutting-edge Rigaku SmartLab XRD system, equipped with the industry-leading HyPix 3000 detector and a 9kW rotating anode source for maximized signal and accuracy.
With world class expertise and instrumentation, Covalent Metrology is ready to support any and all of your x-ray characterization needs.
Learn more at: https://covalentmetrology.com