Stereoscopic Scanning Electron Microscopy (SSEM): A Breakthrough Alternative for High-Res Surface Profilometry 

Join this informative one-hour webinar for a deep dive into modern Failure Analysis techniques used to diagnose issues in electronics and advanced products. This session will demonstrate how a tailored analysis plan and state-of-the-art analytical methods can help resolve complex failures across a wide range of applications by uncovering the root cause.

Practical case studies that showcase the efficacy of this process will be presented. We will demonstrate how modern analytical techniques can be applied to materials, components, and assemblies to uncover deeper insights. Common failures, ranging from printed circuit board assembly (PCBA) solder joint issues to corrosion, contamination, and fractography, will be discussed.

Whether you’re involved in electronics manufacturing, materials development, quality assurance, or product reliability, this session will give you insights and methods to investigate root causes and prevent future failures. You’ll also learn how Covalent deploys integrated FA workflows to deliver fast, accurate, and actionable results.

What You’ll Learn

• Essential FA Process and Techniques – Understand the diagnostics methods and the core methods used in FA, including mechanical cross-sectioning, SEM/TEM/EDS, dye-and-pry, FTIR spectroscopy, and X-ray inspection among others.
• Case Studies Across Industries – See real examples of failure investigations involving PCBs or BGA components, metallurgical corrosion, fractography etc….
• Lab Capabilities and Workflows – Discover how Covalent performs comprehensive FA using state-of-the-art instrumentation and collaborative engineering.
• Live Q&A Session – Ask your questions directly to Covalent’s FA experts