Stereoscopic Scanning Electron Microscopy (SSEM): A Breakthrough Alternative for High-Res Surface Profilometry
Join this informative one-hour webinar for a deep dive into modern Failure Analysis techniques used to diagnose issues in electronics and advanced products. This session will demonstrate how a tailored analysis plan and state-of-the-art analytical methods can help resolve complex failures across a wide range of applications by uncovering the root cause.
Practical case studies that showcase the efficacy of this process will be presented. We will demonstrate how modern analytical techniques can be applied to materials, components, and assemblies to uncover deeper insights. Common failures, ranging from printed circuit board assembly (PCBA) solder joint issues to corrosion, contamination, and fractography, will be discussed.
Whether you’re involved in electronics manufacturing, materials development, quality assurance, or product reliability, this session will give you insights and methods to investigate root causes and prevent future failures. You’ll also learn how Covalent deploys integrated FA workflows to deliver fast, accurate, and actionable results.
What You’ll Learn
- Essential FA Process and Techniques – Understand the diagnostics methods and the core methods used in FA, including mechanical cross-sectioning, SEM/TEM/EDS, dye-and-pry, FTIR spectroscopy, and X-ray inspection among others.
- Case Studies Across Industries – See real examples of failure investigations involving PCBs or BGA components, metallurgical corrosion, fractography etc….
- Lab Capabilities and Workflows – Discover how Covalent performs comprehensive FA using state– of– the– art instrumentation and collaborative engineering.
- Live Q&A Session – Ask your questions directly to Covalent’s FA experts
Register Now!
About the Speakers
Pralav Shetty
VP and GM, Electron Microscopy and Failure Analysis, Covalent Metrology
Dr. Pralav Shetty is a metallurgist and electron microscopist by training. He specializes in in situ and operando characterization of material evolution in response to external stimuli like heat, biasing, and environmental degradation. He has an extensive background in failure analysis of electronic devices. He has also supported litigation cases involving hardware products. He joined Covalent in January 2023 and has been providing customers from diverse industries with consulting, root causes analysis, and remediation support. He currently serves as the VP&GM of Electron Microscopy and Failure Analysis at Covalent.
Audrey Chamoire
Director of Failure Analysis, Covalent Metrology
Dr. Audrey Chamoire joined Covalent Metrology in 2021 and leads the Failure Analysis practice. She specializes in material characterization and thermal/electrical property measurements along with failure analysis of complex assemblies, including PCBs and microelectronic devices. With extensive experience working in startup environments, she understands the fast-paced, high-impact needs of innovative companies.
Driven by technology and passionate about her work, Dr. Chamoire is always eager to explore new techniques and collaborate with clients. She takes great interest in understanding the unique challenges our customers face and is committed to helping them solve complex problems through tailored analytical solutions.