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Wavelength Dispersive X-ray Fluorescence Spectroscopy (WDXRF)

Wavelength Dispersive X-ray Fluorescence Spectroscopy Main Image
GST thin film used in phase-change random access memory devices (PRAM), deposited by ALD; film was analyzed using both ED-XRF and WD-XRF to show comparable peak resolution between the techniques.

Wavelength Dispersive X-ray Fluorescence (WDXRF) provides highly precise, non-destructive elemental analysis, ideal for quality control in semiconductor manufacturing and other applications. Customers choose WDXRF when they need highly accurate thin film composition, thickness, and contamination analysis across wafers or materials.

Application areas:

  • Semiconductor manufacturing (front-end and back-end)
  • Compound semiconductors (GaN, SiC, InP, etc.)
  • Data storage media (hard drives, magnetic films)
  • Solar/Photovoltaics
  • Display technologies (OLED, LCD)
  • Advanced packaging and interconnects
  • Research and development labs

Strengths

  • High accuracy and precision for thin films and multilayers
  • Non-destructive analysis
  • Excellent performance for light and heavy elements
  • Wide dynamic range: ppm to 100%
  • Automated, production-ready platform
  • Minimal sample prep
  • Long-term stability for inline/QA monitoring
  • Quantitative analysis without standards (Fundamental Parameters method)

Limitations

  • Lower throughput compared to techniques like TXRF for quick screening
  • Requires flat and relatively uniform samples
  • Vacuum or helium atmosphere may not be compatible with volatile samples
  • Typically limited to surface and near-surface layer analysis
  • Larger footprint instrument compared to handheld or benchtop XRF

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Example Outputs Instruments Used How WDXRF Works

Sample Requirements

WDXRF Example Outputs

Example Output 1

Variation of the Ti X-ray fluorescence signal over a TiN coated wafer

WDXRF Instruments Used

Rigaku AZX 400

Rigaku AZX 400

  • Element range: Be (Z=4) to U (Z=92)
  • Detection limits: sub-ppm to percent levels
  • Film thickness: ~1 nm to several microns
  • Spectrometer: High-resolution WDXRF with multiple analyzing crystals
  • X-ray tube: Rh target sealed tube, maximum rating: 4 kW
  • Detector: Scintillation counter (SC) for wavelengths shorter than 0.336nm (heavy elements); Flow proportional counter (F-PC) for wavelengths longer than 0.154nm (light elements)
  • Goniometer: θ-2θ independent drive system
  • Angle reproducibility: within 0.0005°
  • Sample stage: Fully automated, programmable R-theta stage drive
  • Diaphragm: Automatic 7 positions exchanger: 30, 20, 10, 1, and 0.5 mm (diameter); with attenuator (X-ray intensity: 1/10): 30, 20 mm (diameter)
  • Analyzing crystals: Automatic crystal changer: LiF (200), Ge, PET, RX9, RX25, RX35, RX45, RX61, RX75
  • Sample chamber atmosphere: Vacuum with Automatic Pressure Control (APC)
  • Software: Advanced quantitative analysis via Fundamental Parameters
  • Throughput: Optimized for high-volume semiconductor fabs
  • Wafer loader unit: Facilitates automatic transfer of 300mm dia. wafer from SEMI-compliant FOUP or FOSB
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How WDXRF Works

Wavelength Dispersive X-ray Fluorescence (WDXRF) works by irradiating a sample with primary X-rays, which causes atoms in the sample to emit secondary (fluorescent) X-rays. These emitted X-rays are characteristic of the elements present in the sample. Unlike EDXRF, WDXRF separates these emitted X-rays by wavelength using crystal diffraction, providing superior spectral resolution and accuracy.

The AZX 400 detects and quantifies elemental concentrations by measuring the intensity of characteristic wavelengths. The instrument uses automated multi-crystal spectrometers and vacuum/helium atmospheres to improve sensitivity, especially for light elements. This allows for detection of ultra-thin films and trace contamination, even in complex stacks or low-Z materials.

The final output includes precise quantification of film thickness, composition, and impurity levels. This data is critical in semiconductor production for verifying metal film deposition, controlling process drift, and identifying contamination that could affect device performance.

Possible measurements:

Learn more about using Wavelength Dispersive X-ray Fluorescence Spectroscopy services today!