
Attenuated Total Reflectance (ATR)
$99 Base price Go to quote list
Advanced Optical Microscopy (VH Microscope)
Optical microscopy is ubiquitous in diverse fields within academic research and commercial industries. It is an affordable, rapid analytical imaging technique used to visualize samples. While optical microscopes may be common, many instruments fall far short on performance when compared with the cutting-edge digital microscope systems available at Covalent.

Atomic Force Microscopy (AFM)
Atomic Force Microscopy (AFM) measures surface topography of materials with sub-nm vertical resolution. The technique delivers fast data, with simple scans requiring only a few minutes to complete.

Attenuated Total Reflectance FTIR (ATR-FTIR)
Attenuated-total-reflectance (ATR) is a sampling mode which enhances the Fourier Transformed Infrared Spectroscopy (FTIR) signal obtained from sample surfaces, increasing sensitivity and allowing efficient measurements with minimal sample preparation. Like standard FTIR measurements, ATR-FTIR is used for chemical qualification of a sample from raw optical spectra and is often used to determine organic composition.

Auger Electron Spectroscopy (Auger)
Auger electron spectroscopy (AES) is a surface-sensitive analytical technique with high lateral resolution. It is used to quantify and map the elemental composition of the outermost 2-10 nm of a material.

Chromatic Dispersion Profilometry (CDP)
Chromatic dispersion profilometry is a non-contact, nondestructive analytical technique used to measure surface topography. It is particularly well suited for large area characterization (e.g. full wafers) requiring high vertical accuracy.

Differential Scanning Calorimetry (DSC)
Differential scanning calorimetry (DSC) is a thermal analysis technique used to characterize a variety of temperature-dependent physical and chemical changes in a material.

Dye & Pry Testing
Dye and Pry testing is a destructive, IPC-prescribed failure-analysis and quality-control technique performed on solder joints on printed circuit board assemblies (PCBA) to identify certain defects unique to solder joints, such as: cracks, “head-in-pillow” defects, and other joint separations. Even when compared against X-ray analytical techniques, 'Dye and Pry' remains the most widely accepted technique for characterizing solder-ball die-attach quality defects. Our technical experts have over 20 years of experience executing Dye & Pry analysis in accordance with IPC standards.

Dynamic Light Scattering (DLS)
Dynamic light scattering (DLS) is an indirect, high-throughput method for measuring the sizes - by hydrodynamic diameter (HDD) - of particles in a solution.

Dynamical Mechanical Analysis (DMA)
Dynamical mechanical analysis (DMA) is used to study changes in the mechanical properties of a material under periodic stress as the temperature is varied. DMA results are used to assess: glass transitions, melting points, elastic modulus, strain-to-break, toughness, creep, and numerous other thermal and mechanical properties.

Electron Probe Microanalysis (EPMA)
Electron probe microanlysis (EPMA) is a non-destructive technique used for high-sensitivity, quantitative determination of the elemental composition of a material.

Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)
Like other high-resolution scanning electron microscopes, Focused-ion-beam scanning electron microscopes (FIB-SEMs) are used to produce 2D and 3D images of surface topography, and are able to resolve nm-scale features on a sample surface. The FIB allows advanced analytical workflows such as: cross-section, tomography, lithography, lamella prep, and many others.

Fourier Transformed Infrared Spectroscopy (FTIR)
Fourier-transformed infrared spectroscopy (FTIR) is a nondestructive, optical technique used to analyze chemical composition and the optical properties of a material.
Techniques Showcase

Ion Scattering Spectroscopy (ISS)
Ion scattering spectroscopy (ISS) provides quantitative elemental composition information from the very outermost atomic layer of a surface....

Micron-spot Energy Dispersive X-ray Fluorescence Spectroscopy (Micro-EDXRF)
EDXRF is a fast, nondestructive spectroscopy technique used to determine the elemental composition of a near-surface volume, and...

Ultraviolet Photoelectron Spectroscopy (UPS)
UPS is often performed in conjunction with X-ray Photoelectron Spectroscopy (XPS), a powerful surface chemical characterization technique. Unique...

Scanning Acoustic Microscopy (SAM)
Scanning Acoustic Microscopy (SAM) is a non-destructive and non-invasive imaging technique which uses ultrasound signals to visualize the...

Scanning Transmission Electron Microscopy (STEM)
STEM is a hybrid electron microscopy technique used for imaging and morphological characterization with atomic-scale resolution. In Covalent's...

Transmission Electron Microscopy (TEM)
TEM is the highest-resolution imaging technique available today. It is used to visualize sample features with atomic-level spatial...

Transmission Electron Microscopy (TEM)
TEM is the highest-resolution imaging technique available today. It is used to visualize sample features with atomic-level spatial...

Ion Scattering Spectroscopy (ISS)
Ion scattering spectroscopy (ISS) provides quantitative elemental composition information from the very outermost atomic layer of a surface....

X-ray Computed Tomography (Micro-CT)
X-ray computed tomography (often referred to as Micro-CT due to its spatial resolution) is a non-contact, nondestructive 2D...

Micron-spot Energy Dispersive X-ray Fluorescence Spectroscopy (Micro-EDXRF)
EDXRF is a fast, nondestructive spectroscopy technique used to determine the elemental composition of a near-surface volume, and...

Ultraviolet Photoelectron Spectroscopy (UPS)
UPS is often performed in conjunction with X-ray Photoelectron Spectroscopy (XPS), a powerful surface chemical characterization technique. Unique...