Attenuated Total Reflectance (ATR)
$99 Base price View My Quote RequestMicroscopy & Imaging
Covalent provides microscopy imaging services with a host of cutting-edge instruments for scanning probe microscopy (including atomic force microscopy), optical profilometry (including confocal microscopy), and electron microscopy imaging. These systems enable structural analysis and chemical mapping that allow you to investigate defects, deformations, multilayer film stacks, particles, and more.
Imaging analysis empowers engineers with morphological insights into their materials, parts, and devices. Use high-resolution microscopy to analyze surface and substructure topologies in your samples and to make measurements of critical dimensions and surface roughness.
20 techniques found in Microscopy & Imaging
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Atomic Force Microscopy (AFM)
In Material Testing,Microscopy & Imaging
Atomic Force Microscopy (AFM) measures surface topography of materials with sub-nm vertical resolution. The technique delivers fast data, with simple scans requiring only a few minutes to complete.
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Auger Electron Spectroscopy (AES)
In Analytical Chemistry,Microscopy & Imaging,Failure Analysis
Auger electron spectroscopy (AES) is a surface-sensitive analytical technique with high lateral resolution. It is used to quantify and map the elemental composition of the outermost 2-10 nm of a material.
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Cathodoluminescence (CL)
In Material Testing,Microscopy & Imaging
Cathodoluminescence (CL) is a combination microscopy and spectroscopy technique that produces high-speed spectral maps of optical emissions with nanoscale resolution. It is used to probe diverse features and properties of materials and devices, from the internal structures of direct bandgap semiconductors to surface plasmon resonances in metallic nanoparticles.
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Chromatic Dispersion Profilometry (CWL)
In Microscopy & Imaging
Chromatic dispersion profilometry or Chromatic white light (CWL) profilometry is a non-contact, nondestructive analytical technique used to measure surface topography. It is particularly well suited for large-area characterization (e.g. whole wafers) requiring high vertical accuracy.
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Digital Optical Microscopy (VH Microscope)
In Microscopy & Imaging,Failure Analysis
Optical microscopy is ubiquitous in diverse fields within academic research and commercial industries. It is an affordable, rapid analytical imaging technique used to visualize samples. While optical microscopes may be common, many instruments fall far short on performance when compared with the cutting-edge digital microscope systems available at Covalent.
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Electron Probe Microanalysis (EPMA)
In Analytical Chemistry,Microscopy & Imaging
Electron probe microanlysis (EPMA) is a non-destructive technique used for high-sensitivity, quantitative determination of the elemental composition of a material.
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Emission Microscopy (EMMI)
In Analytical Services,Microscopy & Imaging,Failure Analysis
Emission Microscopy (EMMI) is a non-invasive and non-destructive optical analysis technique used to localize photon emissions from fault points on integrated circuits. It is the industry-leading failure analysis technique used to isolate and analyze particular electrical failure types, such as: defective or leaky semiconductor junctions, ESD-induced damage, latch-up, and leakage current or overcurrent, among others.
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Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)
In Microscopy & Imaging
Like other high-resolution scanning electron microscopes, Focused-ion-beam scanning electron microscopes (FIB-SEMs) are used to produce 2D and 3D images of surface topography, and are able to resolve nm-scale features on a sample surface. The FIB allows advanced analytical workflows such as: cross-section, tomography, lithography, lamella prep, and many others.
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Infrared Thermography (IRT)
In Analytical Services,Microscopy & Imaging,Failure Analysis
Infrared thermography (IRT) is the leading non-invasive and non-destructive method used to detect and localize material defects, short circuits, and other powered failures. It works by analyzing the heat dissipation that results from these device faults. Infrared thermography can be used to measure the heat distribution in integrated circuits (die) and printed circuit boards, and nearly any powered device to detect hot spots.
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Laser Scanning Confocal Microscopy (LSCM)
In Microscopy & Imaging
Laser scanning confocal microscopy (also called "VK" for the instrument used) is a nondestructive technique which generates 2D and 3D images of a sample surface. Covalent's laser confocal microscopes can accomplish both optical imaging (using broadband white light) and laser-confocal imaging.
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Near-infrared Imaging (NIR)
In Analytical Services,Microscopy & Imaging,Failure Analysis
Near-infrared imaging (NIR) is a nondestructive, noninvasive, and highly efficient method for localizing certain defects in photovoltaics and solar cells via electroluminescence. The technique is also a viable means of localizing defects in NIR fiber optic systems and lasers as well as monitoring high-temperature systems. NIR is currently seeing a growing field of application in pharmaceutical and polymers applications.
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Raman Microscopy (Raman)
In Analytical Services,Analytical Chemistry,Material Testing,Microscopy & Imaging
Raman spectroscopy is a chemical analysis technique which probes the vibrational modes of compounds. It produces a spectrum which can provide fingerprint identification of materials when compared against a reference library of known standards.
Techniques Showcase
Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)
In Microscopy & Imaging
FIB-SEM systems are used to produce 2D and 3D images of surface topography, and are able to resolve...
Nanoindentation (Nano-Indent)
In Material Testing,Failure Analysis
Nanoindentation is a quasi-static mode of nanomechanical analysis used to measure hardness and reduced elastic modulus of solid...
Scanning Acoustic Microscopy (SAM)
In Microscopy & Imaging,Failure Analysis
Scanning Acoustic Microscopy (SAM) is a non-destructive and non-invasive imaging technique which uses ultrasound signals to visualize the...
Scanning Transmission Electron Microscopy (STEM)
In Microscopy & Imaging,Particle Analysis
STEM is a hybrid electron microscopy technique used for imaging and morphological characterization with atomic-scale resolution. In Covalent's...
Transmission Electron Microscopy (TEM)
In Microscopy & Imaging,Particle Analysis
TEM is the highest-resolution imaging technique available today. It is used to visualize sample features with atomic-level spatial...
Glow Discharge Optical Emission Spectroscopy (GDOES)
In Analytical Chemistry
Glow discharge optical emission spectroscopy (GDOES) is a quantitative, chemical analytical technique used to study the elemental composition...
Inductively Coupled Plasma Mass Spectroscopy (ICP-MS)
In Analytical Services,Analytical Chemistry
Inductively Coupled Plasma Mass Spectroscopy (ICP-MS) is a highly sensitive chemical analysis technique which measures the elemental composition...
Capillary Flow Porometry (Porometry)
In Material Testing
Capillary Flow Porometry (also called Porometry) is an optimal technique for characterizing through-pore size and size distribution.
Porosimetry
In Material Testing
Gas Adsorption Analysis is used for measuring specific surface area, pore sizes / size distribution, and overall porosity...
Tap Density Analysis
In Material Testing
Tap Density Analysis provides fast, effective measurements of the bulk density of powders and establishes a quantitative metric...
Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)
In Microscopy & Imaging
FIB-SEM systems are used to produce 2D and 3D images of surface topography, and are able to resolve...
X-ray Computed Tomography (Micro-CT)
In Microscopy & Imaging,X-ray Analysis,Failure Analysis
X-ray computed tomography (often referred to as Micro-CT due to its spatial resolution) is a non-contact, nondestructive 2D...
Nanoindentation (Nano-Indent)
In Material Testing,Failure Analysis
Nanoindentation is a quasi-static mode of nanomechanical analysis used to measure hardness and reduced elastic modulus of solid...
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