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Microscopy & Imaging

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Covalent provides microscopy imaging services with a host of cutting-edge instruments for scanning probe microscopy (including atomic force microscopy), optical profilometry (including confocal microscopy), and electron microscopy. These systems enable structural analysis and chemical mapping that allow you to investigate defects, deformations, multilayer film stacks, particles, and more.

Imaging analysis empowers engineers with morphological insights into their materials, parts, and devices. Use high-resolution microscopy to analyze surface and substructure topologies in your samples and to make measurements of critical dimensions and surface roughness.

21 techniques found in Microscopy & Imaging
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Advanced Optical Microscopy
Advanced Optical Microscopy (VH Microscope)
In Failure Analysis,Microscopy & Imaging
Base Price: $225 per Hour

Optical microscopy is ubiquitous in diverse fields within academic research and commercial industries. It is an affordable, rapid analytical imaging technique used to visualize samples. While optical microscopes may be common, many instruments fall far short on performance when compared with the cutting-edge digital microscope systems available at Covalent.

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Atomic Force Microscopy
Atomic Force Microscopy (AFM)
In Material Property Analysis,Microscopy & Imaging
Base Price: $225 per Image

Atomic Force Microscopy (AFM) measures surface topography of materials with sub-nm vertical resolution. The technique delivers fast data, with simple scans requiring only a few minutes to complete.

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Auger Electron Spectroscopy (AES)
Auger Electron Spectroscopy (AES) (Auger)
In Chemical Composition,Failure Analysis,Microscopy & Imaging
Base Price: $335 per Hour

Auger electron spectroscopy (AES) is a surface-sensitive analytical technique with high lateral resolution. It is used to quantify and map the elemental composition of the outermost 2-10 nm of a material.

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Chromatic Dispersion Profilometry
Chromatic Dispersion Profilometry (CDP)
In Microscopy & Imaging
Base Price: $360 per Hour

Chromatic dispersion profilometry is a non-contact, nondestructive analytical technique used to measure surface topography. It is particularly well suited for large area characterization (e.g. full wafers) requiring high vertical accuracy.

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Electron Probe Microanalysis
Electron Probe Microanalysis (EPMA)
In Chemical Composition,Microscopy & Imaging
Base Price: $325 per Sample

Electron probe microanlysis (EPMA) is a non-destructive technique used for high-sensitivity, quantitative determination of the elemental composition of a material.

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Emission Microscopy
Emission Microscopy (EMMI)
In Analytical Services,Failure Analysis,Microscopy & Imaging
Base Price: $300 per Hour

Emission Microscopy (EMMI) is a non-invasive and non-destructive optical analysis technique used to localize photon emissions from fault points on integrated circuits. It is the industry-leading failure analysis technique used to isolate and analyze particular electrical failure types, such as: defective or leaky semiconductor junctions, ESD-induced damage, latch-up, and leakage current or overcurrent, among others.

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Focused Ion Beam Scanning Electron Microscopy
Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)
In Microscopy & Imaging
Base Price: $425 per Hour

Like other high-resolution scanning electron microscopes, Focused-ion-beam scanning electron microscopes (FIB-SEMs) are used to produce 2D and 3D images of surface topography, and are able to resolve nm-scale features on a sample surface. The FIB allows advanced analytical workflows such as: cross-section, tomography, lithography, lamella prep, and many others.

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Infrared Thermography
Infrared Thermography (IRT)
In Analytical Services,Failure Analysis,Microscopy & Imaging
Base Price: $300 per Hour

Infrared thermography is the leading non-invasive and non-destructive method used to detect and localize material defects, short circuits, and other powered failures. It works by analyzing the heat dissipation that results from these device faults. Infrared thermography can be used to measure the heat distribution in integrated circuits (die) and printed circuit boards, and nearly any powered device to detect hot spots.

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Laser Scanning Confocal Microscopy
Laser Scanning Confocal Microscopy (LSCM)
In Microscopy & Imaging
Base Price: $300 per Hour

Laser scanning confocal microscopy (also called "VK" for the instrument used) is a nondestructive technique which generates 2D and 3D images of a sample surface. Covalent's laser confocal microscopes can accomplish both optical imaging (using broadband white light) and laser-confocal imaging.

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Micron-spot Energy Dispersive X-ray Fluorescence Spectroscopy
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Near-infrared Imaging
Near-infrared Imaging (NIR)
In Analytical Services,Failure Analysis,Microscopy & Imaging
Base Price: $300 per Hour

Near-infrared imaging (NIR) is a nondestructive, noninvasive, and highly efficient method for localizing certain defects in photovoltaics and solar cells via electroluminescence. The technique is also a viable means of localizing defects in NIR fiber optic systems and lasers as well as monitoring high-temperature systems. NIR is currently seeing a growing field of application in pharmaceutical and polymers applications.

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Raman Microscopy
Raman Microscopy (Raman)
In Analytical Services,Chemical Composition,Material Property Analysis,Microscopy & Imaging
please contact us for pricing

Raman spectroscopy is a chemical analysis technique which probes the vibrational modes of compounds. It produces a spectrum which can provide fingerprint identification of materials when compared against a reference library of known standards.

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