Scanning Acoustic Microscopy (SAM)

Scanning Acoustic Microscopy
High resolution, dynamic through-scan image of microelectronic chip, produced with dual autofocusing transducer array. Delamination / voids are indicated by dark contrast

Scanning Acoustic Microscopy (SAM) is a non-destructive and non-invasive imaging technique which uses ultrasound signals to visualize the internal structures of a sample.

Strengths
  • High penetration depth enables visualization of underlying and internal structures
  • Able to characterize buried topographies which are difficult or impossible to resolve with other microscopy techniques
  • Non-destructive analysis, however sample will get wet
Limitations
  • Slower processing time than micro-CT
  • Reduced spatial resolution compared to electron microscopy techniques
Base Prices
Technique Variants
Pricing Starts At
Action
Scanning Acoustic Microscopy (SAM)
$450 / Hour
Example Outputs

C-Scan performed on Cu disc. Identified solder delamination via bright spots (indicating voids) around the outer ring of the disk

From: PVA TePla

C-Scan collected on a die bump pad using analog pre-processing of radio-frequency data with HILBERT signal integration conducted in real time during scan. This unique capability facilitates improved signal-to-noise ratio and sharper contrast.

From: PVA TePla

High resolution, dynamic through-scan image of microelectronic chip, produced with dual autofocusing transducer array. Delamination / voids are indicated by dark contrast

Instruments Used for SAM
PVA TePla SAM 302 HD<sup>2</sup>

PVA TePla SAM 302 HD2

  • Frequency Range: 400 MHz
  • Lateral Scan Range: 200 mm x 200 mm
  • Vertical Scan Range: up to 320 mm
  • Minimum Pixel Size: 0.5 µm
  • Delamination Detectability: 0.2 µm
PVA TePla SAM 502 HD<sup>2</sup>

PVA TePla SAM 502 HD2

  • Frequency Range: 400 MHz
  • Lateral Scan Range: 200 mm x 200-500 mm
  • Vertical Scan Range: up to 500 mm
  • Minimum Pixel Size: 0.5 µm
  • Delamination Detectability: 0.2 µm
Sample Requirements
  • Solid phase required
  • Samples must be structurally and chemically stable in deionized water
  • Irregular shapes and many-layered materials impair resolution, especially when materials are soft, porous, or very rough (impaired sound scattering consistency)
  • Max sample dimensions: 670 mm x 560 mm x 70 mm
How SAM Works

The working principle of SAM relies on the detection of how acoustic waves interact with material interfaces. The two primary modes of detection are reflection and transmission.

In a routine measurement, a sample is submerged in a coupling media (i.e. water) and subjected to high frequency acoustic waves generated by a piezoelectric transducer. The resulting echoes due to acoustic impedance (Z) contrast at the material interfaces are then analyzed to produce images.

The lateral resolution is dependent on the frequency of the transducer and the speed of sound through the material. Higher frequency transducers offer higher resolution, but do not penetrate far for thick samples.

Covalent provides acoustic microscopy services on PVA TePla’s premium-line of SAM instruments with an array of two independently autofocusing and signal-balancing transducers to achieve the highest possible resolution and contrast in acoustic images.

Comparison link sent successfully
Please use valid email address
You need to have at least 2 techniques to compare
You can select maximum 5 techniques
Covalent uses cookies to improve your browsing experience and to help you access the most relevant information and services efficiently. To learn more, view our
Decline
I Accept Cookies
techniques selected
Select at least 2 techniques to compare Compare techniques