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Wide Area 3D Patterned Light Measurement
Wide Area 3D / Patterned Light measurements encompass a class of optical profilometry techniques used to visualize the surface topography of larger samples.
- Greatest scan area among optical profilometry techniques (cm scale)
- High vertical resolution ( limit < 5 um) with balanced lateral resolution ( ~5 um)
- Non-destructive analysis
- Contour and warp will affect surface roughness analysis
- Highly transparent or specular reflective surfaces
- High aspect ratio dimensions that block the light source
Above shows 3D model output of a trapezoidal screw scanned from single angle; below is a 2D plot showing the critical dimensions of the threads.
Integrated analysis of 4 different samples, showing: (in leftmost column) top-down true-color images; (in middle column) 3D CAD models generated from the original Patterned Light scans with variable color-coded topographical features – including roughness (A) and total height (C); and (in rightmost column) 2D cross-sectional plots of bump height contrasting the critical dimension of the 4 prongs in each sample.
Terminal charge port connector for handheld charging dock.
- Solid phase
- Features of interest (critical dimensions or surface topology) in XY or Z need to be > 5um
- One-shot 3D Measurements: generate instant 3D CAD model from single scan
- Fully automated stitching of expanded X-Y field of view
- Magnification Range: 12x to 160x
- Maximum Measurable Height Range:
- 10 mm in Wide-Field Mode (magnification up to 50x)
- 1 mm in High-Mag Mode (magnification 40x to 160x)
- Height Accuracy:
- ± 5 μm in Wide-Field Mode
- ± 2 μm in High-Mag Mode
In a Patterned Light measurement, striped patterns of light are projected onto the sample at a known angle of incidence from opposing directions.
A camera mounted directly above the sample captures the distortion of the bands of light due to changes in the height of the samples surface. The measured distortions are triangulated among different patterns to generate a quantitative 3D model of the surface topography.
Unique to this technique, the generated 3D model is compatible for output as a CAD overlay for volumetric comparison in process and part evaluation.
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